Open-Source FPGA Foundation’s “Tape Out World” Initiative

SALT LAKE CITY, Utah, May 25, 2021 – Open-Source FPGA Foundation (OSFPGA) has launched the “Tape Out World” initiative which is a key component of it’s push for democratizing silicon and purpose to promote design and manufacture of prototype FPGAs (and CPUs and other chips) world wide. In this effort OSFPGA will collaborate with Efabless Corporation, leveraging it’s ChipIgnite program that provides a pre-designed carrier-chip along with automated open-source design flow and full chip template making easy, affordable, and rapid implementation of custom chip design.  The initiative will be operated by OSFPGA’s Tape Out World Committee with a global and modular approach and a roadmap for jumpstarting country specific programs, with Tape Out USA as default and others following in rapid succession.   At the high level, the idea of the Tapeout World and underlying country initiative is simple and scalable, where a few universities having at least two faculty researchers in chip design are identified in each country by a Country Champion who is a community or corporate member of OSFPGA.  They are in turn enabled to organize at least two student projects all the way from design-through-tapeout on the EFabless platform.  While the primary targets are universities, research institutes and startups can be supported.  The tape outs are funded via sources vested in technology and ecosystem development identified by the country champion.   OSFPGA will be announcing a series of such programs in Q2 2021 and beyond with several identified countries already in the pipeline process. Program Package Includes: Design & Tape Out via Efabless ChipIgnite Platform and Services 

End-to-End Training via OSFPGA Education & Training Committee (ETC) Programs in collaboration with partners (VLSI System Design, Inc., and Redwood EDA Corporation) How It Works:

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