SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
WEST LAFAYETTE, Ind. — SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park. The development of a critical link in the U.S. semiconductor supply chain in West Lafayette marks a giant leap forward in the industry and the state.
“We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung. “We believe this project will lay the foundation for a new Silicon Heartland, a semiconductor ecosystem centered in the Midwest Triangle. This facility will create local, high-paying jobs and produce AI memory chips with unmatched capabilities, so that America can onshore more of its critical chip supply chain. We are grateful for the support of Gov. Holcomb and the state of Indiana, of President Chiang at Purdue University, and of the broader community involved, and we look forward to expanding our partnership in the long run.”
SK hynix joins Bayer, imec, MediaTek, Rolls-Royce, Saab and many more national and international companies bringing innovation to America's heartland. The new facility — home to an advanced semiconductor packaging production line that will mass-produce next-generation high-bandwidth memory, or HBM, chips, the critical component of graphic processing units that train AI systems such as ChatGPT — is expected to provide more than a thousand new employment opportunities in the Greater Lafayette community. The company plans to begin mass production in the second half of 2028.
