Intel is matching foundry rival, TSMC, node-for-node with its new process naming convention, but has also fired the first shot in the race for sub-nan

Nanometer no more: Intel changes its process names to match TSMC

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2021-07-27 12:30:05

Intel is matching foundry rival, TSMC, node-for-node with its new process naming convention, but has also fired the first shot in the race for sub-nanometer terminology. Below 1nm, we're moving into what it's now calling the 'angstrom era of semiconductors'.

At the Intel Accelerated event CEO, Pat Gelsinger, has unveiled a detailed process roadmap for its future nodes, all tied into a new way to reference them. "We are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," he says. 

Gelsinger goes on to note that Intel "will be relentless in our pursuit of Moore’s Law and our path to innovate with the magic of silicon."

You've got to love the way that Gelsinger is talking about his company now he's back and in the top job. I can't imagine Bob Swan or Brian Krzanich ever talking about 'the magic of silicon,' and it's refreshing to have some passion back in there with Intel's latest CEO.

This acceleration and re-marketing also reads as a smart move with Intel pushing forward with its IDM 2.0 strategy and launching its contract foundry business to rival the likes of TSMC. And what better way to measure yourself against the competition than by aligning your node naming conventions with theirs? 

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