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Materials just atoms in thickness, known as two-dimensional (2D) materials, are set to revolutionize future technology, including in the electronics industry. However, commercialization of devices that contain 2D materials has faced challenges due to the difficulty in transferring these extremely thin materials from where they are made onto the device.
Now, a research team from Kyushu University, in collaboration with Japanese company Nitto Denko, have developed a tape that can be used to stick 2D materials to many different surfaces, in an easy and user-friendly way. The findings were published in Nature Electronics on Feb. 9, 2024.
"Transferring 2D materials is typically a very technical and complex process; the material can easily tear, or become contaminated, which significantly degrades its unique properties," says lead author, Professor Hiroki Ago of Kyushu University's Global Innovation Center. "Our tape offers a quick and simple alternative, and reduces damage."