Hybrid Bonding Process Flow - Advanced Packaging Part 5
Hybrid bonding is going to be the most transformative innovation to semiconductor manufacturing since EUV. In fact, it will have an even bigger impact on the design process than EUV itself, branching from package architecture down to cell design and layouts. The IP ecosystem will be dramatically reshaped, but so will manufacturing flows. The era of shrinking transistors in 2D will continue, but at a muted pace, but hybrid bonding will bring in a new age, where chip designers think 3D.
With that hype filled ballad finished, we should note there are many major engineering and technical challenges for bringing hybrid bonding to market in high volume, as today it is only reserved to a few AMD chips, CMOS image sensors, and some vendors 3D NAND. This transition will reshape supply changes and design flows.
We will go from the basics all the way through to advanced aspects of hybrid bonding from process flow, tooling, design use cases, challenges, costs of chip on wafer versus wafer on wafer. We will also walk through our proprietary adoption modeling that captures use, tooling requirements, and volume by market (mobile, client PC, datacenter CPU, AI Accelerator, HBM etc) as well as firm level adoption through to the end of the decade.
