Hybrid Bonding Makes Strides Toward Manufacturability

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical and reliability results.

Advantages include interconnect scaling to submicron pitches, high bandwidth, enhanced power efficiency, and better scaling relative to solder ball connections. But while some chipmakers do have hybrid bonding in high-volume manufacturing (HVM), the cost of the process is too high at present for mass adoption. And because hybrid bonding pulls together front-end and back-end lines, assembly processes such as die placement now must meet front-end specifications.

Other challenges include the need for better copper dishing uniformity, faster die-to-wafer placement with superior alignment, multiple bonding and de-bonding carriers that drive up cost, and lower temperature annealing capability. Finally, particle levels must be driven down especially during die placement and dicing steps.

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