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CoWoS® is a platform provides best-in-breed performance and highest integration density for high performance computing applications. This wafer level system integration platform offers wide range of interposer sizes, number of HBM cubes, and package sizes. It can enable larger than 2X-reticle size (or ~1,700mm2) interposer integrating leading SoC chips with more than four HBM2/HBM2E cubes.
CoWoS-R is a member of CoWoS advanced packaging family leveraging InFO technology to utilize RDL interposer and to serve the interconnect between chiplets, especially in HBM(high bandwidth memory) and SoC heterogeneous integration. RDL interposer is comprised of polymer and copper traces, and it is relatively mechanically flexible. Such flexibility enhances the C4 joint integrity, and allows the new package can scale up its size to meet more complex functional demands.
CoWoS®-L is one of the last for chip packages in the CoWoS® platform, combining the merits of CoWoS®-S and InFO technologies to provide the most flexible integration using interposer with LSI (Local Silicon Interconnect) chip for die-to-die interconnect and RDL layers for power and signal delivery. The offering starts from 1.5X-reticle interposer size with 1x SoC + 4x HBM cubes and will move forward to expand the envelope to larger sizes for integrating more chips.
