Samsung showcases its latest PIM technology at Hot Chips 33 - Korea IT Times
On August 24, Samsung Electronics showcased its latest advancements with processing-in-memory (PIM) technology at Hot Chips 33 — a leading semiconductor conference where the most notable microprocessor and IC innovations are unveiled each year.
Samsung’s revelations include the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system, and broadened PIM applications to embrace DRAM modules and mobile memory, in accelerating the move toward the convergence of memory and logic.
In February, Samsung introduced the industry’s first HBM-PIM (Aquabolt-XL), which incorporates the AI processing function into Samsung's HBM2 Aquabolt, to enhance high-speed data processing in supercomputers and AI applications. The HBM-PIM has since been tested in the Xilinx Virtex Ultrascale+ (Alveo) AI accelerator, where it delivered an almost 2.5X system performance gain as well as more than a 60% cut in energy consumption.
“HBM-PIM is the industry’s first AI-tailored memory solution being tested in customer AI-accelerator systems, demonstrating tremendous commercial potential,” said Nam Sung Kim, senior vice president of DRAM Product & Technology at Samsung Electronics. “Through standardization of the technology, applications will become numerous, expanding into HBM3 for next-generation supercomputers and AI applications, and even into mobile memory for on-device AI as well as for memory modules used in data centers.”
