Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

December 17, 2024, Tokyo, Japan – Elephantech has been mass-producing SustainaCircuits™, innovative printed circuit boards (PCBs) that reduce copper usage by 70-80% using printing technology. However, until now, we could only develop relatively niche single-sided flexible PCBs, which account for only about 2% of the market. The application to general-purpose multilayer PCBs2, which makes up 78%1 of the market, was highly anticipated but not yet realized, with plans for practical implementation after 2027. We are pleased to announce that due to several technological innovations, we have successfully developed general-purpose multilayer PCBs earlier than expected. The main achievements are (1) compatibility with rigid substrates and (2) multilayer capability, enabling the replacement of the majority of PCBs worldwide. This technology not only significantly reduces environmental impacts, including CO2 emissions, but also has the potential to reduce PCB manufacturing costs by over 1 trillion yen annually, primarily by reducing copper usage in general-purpose multilayer PCBs by 70%3, which constitutes a large portion of their cost structure. We are already working with multiple electronics manufacturers and plan to start providing prototypes in the first half of 2025.

We have developed a primer and copper nanoparticle ink that adhere strongly to FR-4. Our printing method requires printing on smooth surfaces to achieve high adhesion, which has been disadvantageous from an adhesion standpoint. Insufficient adhesion has been the biggest challenge in adapting to rigid substrates. The newly developed primer and copper nanoparticle ink for FR-4 demonstrates strong adhesion. Notably, they exhibit high heat resistance, which was previously difficult to achieve. After a 240-hour test at 150°C, they maintain an adhesion strength of over 1.0N/mm*, reaching a level suitable for use in rigid circuit boards.

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